ISSN: 1003-6326
CN: 43-1239/TG
CODEN: TNMCEW

Vol. 10    No. 3    June 2000

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Effects of gradient interlayer on residual stress and
cracking in TiN thin films①
QI Xuan(漆 王睿),LI Ge-yang(李戈扬),
SHI Xiao-rong(施晓荣), L Xia(吕 霞), LI Peng-xing(李鹏兴)
(School of Materials Science and Engineering, ShanghaiJiaotong University,
Shanghai200030, P.R.China
)
Abstract: The influence of a gradient interlayer on the residual stress and cracking in TiN thin films was studied as a function of the thickness of gradient interlayer. Both X-ray in-situ tensile testing and grazing method were used to measure the residual stress in thin films. In TiN films, there exists a residual stress of 10GPa, which can be remarkably decreased by a gradient interlayer between film and substrate. The cracking behavior of films after tension shows that the crack of film/substrate system begins at interface between film and substrate.
Key words: TiN thin film; residual stress; gradient interlayer.
Superintended by The China Association for Science and Technology (CAST)
Sponsored by The Nonferrous Metals Society of China (NFSOC)
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